Fa'aoga: Aerospace, BMS, Feso'ota'iga, Komepiuta, Mea Fa'akomepiuta Fa'atau, Meafaigaluega a le Fale, LED, Mea Fa'afoma'i, Laupapa, Fa'aeletonika atamai, Fa'atonuina le leo
Vaega: Fexible PCB, High density PCB
Mea Fa'agata: Epoxy Resin, Metal Composite Materials, Organic Resin
Laupapa: 1-22 laulau
mafiafia laupapa: 1.6 mm
Kopa mafiafia:1 OZ
Mea fa'avae: FR4
Laititi pu laititi:0.2mm
Laiti laina lautele:4 mil
Ua mae'a: ta'ita'i fua HASL
HT-S1105DS o se mini compact soho 5 taulaga 10/100mbps 4pin ulu feso'ota'iga ki PCBA. E iai le 5 10/100mbps 4pin ulu ulu ua fausia i totonu. Plug n play, e le manaʻomia le faʻatulagaina. Le eletise ulufale 3.3V.
O le malosi, feso'ota'iga/gaoioi ta'ita'i fa'ailoga e maua ai se fofo fa'alavelave vave.
Numera Fa'ata'ita'i: TC280
Vasega: Fa'asagaga Mauga PCB Terminal Blocks
Li'o: 2Pin
Fa'atatau i le taimi nei: 3.0A
Fua Fa'atatau: 200V
PC Board Fa'atonuga Fa'apipi'i: Itu i totonu
Meatotino e taofia ai le afi:V1
Mea Fa'a'ese'ese: Resin Fa'asu'e
Mea: Pepa Fiberglass
Mechanical Rigid: Fexit
Fa'atekonolosi Fa'atekonolosi: Fa'atuai o le Foil Pressure, Foil Electrolytic
Fa'aaogāga: Feso'ota'iga, Komipiuta, Fa'atau Fa'akomepiuta, Mea Fa'afale, Meafaigaluega Fa'afoma'i, Motherboard, Smart Electronics, Uaealesi le molia
Vaega: Fexible PCB, High density PCB
Mea Fa'agata: Epoxy Resin, Mea Fa'apipi'i Fa'atasi
Mea: Fiberglass Epoxy Resin & Polyimide Resin
Fa'atekonolosi Fa'atekonolosi: Fa'atuai o le Foil Pressure, Foil Electrolytic
Fa'aoga: Aerospace, BMS, Feso'ota'iga, Komepiuta, Mea Fa'akomepiuta Fa'atau, Meafaigaluega a le Fale, LED, Mea Fa'afoma'i, Laupapa, Fa'aeletonika atamai, Fa'atonuina le leo
Vaega: Fexible PCB, High density PCB
Mea Fa'agata: Epoxy Resin, Metal Composite Materials, Organic Resin
Mea: Aluminum Ufiufi Fa'alava 'apa apa, Fa'alavelave, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Pepa Phenolic Copper Foil Substrate, Fiber Synthetic
Fa'atekonolosi Fa'atekonolosi: Fa'atuai o le Foil Pressure, Foil Electrolytic
O loʻo matou gaosia pcb ma pcb faʻapotopotoga tasi-taofi auaunaga faleoloa. e 400 tagata atoa. 20% fa'ateleina le fa'atauga i tausaga ta'itasi. 70% gaosiga uma mai fafo. matou te faia 1-12layer.FR4.CEM-1.CEM-3.HDI. AL meafaitino.
Aerospace, Feso'ota'iga, Komepiuta, Consumer Electronics, Mea faigaluega ile fale, LED, Meafaigaluega Fa'afoma'i, Motherboard, Fa'aeletonika atamai, Fa'atonu le leai o se totogi
Meatotino e Puipuia Mu:V0, V1, V2
Mea Fa'agata: Epoxy Resin, Metal Composite Materials, Organic Resin
Mea: Faigata, Fiberglass Epoxy, Pepa Phenolic Copper Foil Substrate, Fiber Synthetic, Le Pepa Ring Gas Resin
Mechanical Rigid: Fexit
Avanoa: Rigid Flex pcb
Fa'alava: Fa'asagaga
Talosaga:
Aerospace, BMS, Feso'ota'iga, Komepiuta, Consumer Electronics, Mea faigaluega ile fale, LED, Meafaigaluega Fa'afoma'i, Motherboard, Smart Electronics, Wireless charged
Mea Fa'agata:
Epoxy Resin, Metal Composite Mea, Resin Organic
Mea:
Ufiufi Alumini Fa'amea 'apa 'apa, Fa'alavelave, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Pepa Phenolic Copper Foil Substrate, Fiber Synthetic
Fa'atekonolosi:
Fa'atuai Fa'aigoa Foil, Electrolytic Foil